IGBT电源模块的静态和动态热特性

11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312) Pub Date : 1999-05-26 DOI:10.1109/ISPSD.1999.764037

C. Yun, P. Regli, J. Waldmeyer, W. Fichtner

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引用次数: 32

摘要

本文讨论了IGBT功率模块在静态和动态条件下的热特性。研究了热干扰和焊料尺寸的影响。在动态响应中，热阻抗由两个过渡时间表征。对于脉宽调制(PWM)方案，考虑了传导和开关损耗，并提出了一个RC分量模型来预测稳态周期条件下的热特性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Static and dynamic thermal characteristics of IGBT power modules

This paper discusses the thermal behavior of an IGBT power module under static and dynamic conditions. Thermal interference and solder size effects were investigated. In the dynamic response, the thermal impedance was characterized by two transition times. For a pulse width modulation (PWM) scheme, conduction and switching losses are considered and a RC component model is proposed to predict the thermal characteristics in steady state periodic condition.

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11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)

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