{"title":"超大规模集成电路测试中拒绝率的经验计算","authors":"Shashank K. Mehta, S. Seth","doi":"10.1109/ICVD.1999.745205","DOIUrl":null,"url":null,"abstract":"Among significant components of testing cost are test-length, reject ratio, and lost-yield. In this paper a new approach is proposed to estimate the reject ratio. The empirical model is based on test-data properties that are believed to be invariant for a wide range of manufacturing technologies and types of tests. The analysis is carried out entirely in terms of the device test data, as might be available from a wafer probe. Experimental results demonstrate the robustness of the model.","PeriodicalId":443373,"journal":{"name":"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Empirical computation of reject ratio in VLSI testing\",\"authors\":\"Shashank K. Mehta, S. Seth\",\"doi\":\"10.1109/ICVD.1999.745205\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Among significant components of testing cost are test-length, reject ratio, and lost-yield. In this paper a new approach is proposed to estimate the reject ratio. The empirical model is based on test-data properties that are believed to be invariant for a wide range of manufacturing technologies and types of tests. The analysis is carried out entirely in terms of the device test data, as might be available from a wafer probe. Experimental results demonstrate the robustness of the model.\",\"PeriodicalId\":443373,\"journal\":{\"name\":\"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-01-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICVD.1999.745205\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Twelfth International Conference on VLSI Design. (Cat. No.PR00013)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICVD.1999.745205","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Empirical computation of reject ratio in VLSI testing
Among significant components of testing cost are test-length, reject ratio, and lost-yield. In this paper a new approach is proposed to estimate the reject ratio. The empirical model is based on test-data properties that are believed to be invariant for a wide range of manufacturing technologies and types of tests. The analysis is carried out entirely in terms of the device test data, as might be available from a wafer probe. Experimental results demonstrate the robustness of the model.