温度范围为- 55°C至+ 125°C的BiCMOS嵌入式RF-MEMS开关的电-热-机械分析

2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems Pub Date : 2013-03-28 DOI:10.1109/SIRF.2013.6489418

M. Wietstruck, M. Kaynak, W. Zhang, B. Tillack

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引用次数: 2

摘要

研究了温度对BiCMOS嵌入式RF-MEMS开关的电气、机械和射频性能的影响。与其只估算与温度相关的RF-MEMS开关关键性能参数，不如了解温度对力学以及相关电学和rf性能的影响。对悬浮膜的详细热力学分析表明，温度变化对膜的形状和接触形成有很大影响。它解释了温度对拉入电压和导通状态电容的显著影响，表明热力学分析对于有效的工艺和设计优化是绝对必要的，以提高温度稳健性。

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Electro-thermo-mechanical analysis of a BiCMOS embedded RF-MEMS switch for temperatures from −55°C to + 125°C

The influence of temperature on electrical, mechanical and RF-performance of a BiCMOS embedded RF-MEMS switch has been demonstrated. Instead of exclusively estimating the temperature-dependent RF-MEMS switch key performance parameters, understanding the temperature influence on the mechanics together with the related electrical and RF-performance is preferred. A detailed thermo-mechanical analysis of the suspended membrane shows that the membrane shape and contact formation is strongly affected by temperature variations. It explains the significant influence of temperature on the pull-in voltage and on-state capacitance showing that a thermo-mechanical analysis is absolutely mandatory for an efficient process and design optimization to increase the temperature robustness.

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2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems

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