{"title":"利用流体自组装将硅电路元件集成到塑料基板上","authors":"S.A. Stauth, B. Parviz","doi":"10.1109/ICMENS.2005.63","DOIUrl":null,"url":null,"abstract":"We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.","PeriodicalId":185824,"journal":{"name":"2005 International Conference on MEMS,NANO and Smart Systems","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Integration of silicon circuit components onto plastic substrates using fluidic self-assembly\",\"authors\":\"S.A. Stauth, B. Parviz\",\"doi\":\"10.1109/ICMENS.2005.63\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.\",\"PeriodicalId\":185824,\"journal\":{\"name\":\"2005 International Conference on MEMS,NANO and Smart Systems\",\"volume\":\"65 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-07-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Conference on MEMS,NANO and Smart Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMENS.2005.63\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Conference on MEMS,NANO and Smart Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMENS.2005.63","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integration of silicon circuit components onto plastic substrates using fluidic self-assembly
We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.