紫外激光直接精细图纹材料电气评定的测试结构

Naoto Usami, A. Higo, Ayako Mizushima, Y. Okamoto, Y. Mita
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引用次数: 0

摘要

在进入微电子时代(小于10μm)的今天,我们提出了一种测试结构来电评估直接激光精细图案。以氧化铟锡(ITO)为例。利用激光烧蚀技术实现高速ITO图像化,有助于缩短光电器件的开发周期,如有机发光二极管。然而,不仅机械引起的线边波动,而且工艺(如热)引起的材料退化也可能影响电线宽度。我们的测试结构的目的是通过测量电性能(即导电性)来评估这种关键尺寸变化。它由开尔文连接直线和不同宽度的希腊叉组成。在相同的测试结构下,采用了紫外激光加工、光刻和等离子体刻蚀。测量结果表明,直接成图条件对微电子器件的损伤较小,表明了直接成图技术在微电子器件研发中的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Test structure for electrical assessment of UV laser direct fine patterned material
We propose a test structure to electrically assess direct laser fine patterning, which is entering a microelectronic era (below 10μm). Indium-Tin-Oxide (ITO) was used as a material example. High speed ITO patterning with laser ablation can contribute short turn-around-time development of opto-electrical devices, such as organic light emitting diode. However, not only machine-induced line-edge fluctuation but also the process (e.g. heat) induced material degradation may affect electrical linewidth. The aim of our test structure is to assess such critical dimension change through measurement of electrical property (i.e. conductivity). It consists of Kelvin-connection straight lines and Greek crosses with various widths. Ultraviolet (UV) laser process as well as lithography and plasma etching were applied with the same test structure. The measurement revealed that the applied direct patterning condition induced small damage, showing applicability of direct patterning in microelectronics R&D.
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