DRAM拓扑单元2T1C、3T1C和4T2C之间的性能和延迟比较

I. Rodríguez-Ibarra, R. M. Woo-García, I. Algredo-Badillo, F. López-Huerta
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引用次数: 0

摘要

基本存储单元是现代电子各种应用中的基础电路。今天,动态随机存取存储器(DRAM)是最相关的数字构建块之一,主要部署在处理器的板载缓存存储器中。在这项工作中,在180纳米技术的设计层面,DRAM单元的不同拓扑被开发为2T1C, 3T1C和4T2C。在Tanner L-Edit IC CAD软件平台上,通过优值图对DRAM的能量性能和读写时延进行了评价,并对其拓扑结构进行了设计和仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparative of performance and delays between topologies cells 2T1C, 3T1C, and 4T2C for DRAM
The basic memory cell is a fundamental circuit in various applications of modern electronics. Today, dynamic random access memory (DRAM) is one of the most relevant digital building blocks largely deployed as on-board cache memory in processors. In this work, at the design level in 180 nm technology, the different topologies for a DRAM cell are developed as 2T1C, 3T1C, and 4T2C. Evaluating its energy performance and delays during the writing and reading stages, through the figure of merit, the design and simulation of the DRAM topologies were carried out in the Tanner L-Edit IC CAD software platform.
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