Bing-Jing Li, Chih-Hsiang Chang, Y. Su, K. Gan, Jianghui Hong
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Application of multi-wall carbon nanotube/SiC composite to thermal dissipation of high-bright light emitting diode
A novel CNT/SiC/epoxy composite was proposed and demonstrated as adhesive joining element and heat dissipation media for HB-LEDs. Junction temperature, luminous intensity and forward voltage were measured for varied combinations in the composites. The experimental results showed that the epoxy with 30 wt% of SiC and 5 wt% of MWCNTs had the best thermal properties. Comparing to commercial epoxy, the CNT/SiC/ epoxy could decrease junction temperature from 123 °C to 93°C and thermal resistance from 81 °C /W to 65 °C/W.
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