{"title":"关于过孔对PCB电源总线的影响","authors":"G. Heinrich, S. Dickmann","doi":"10.1109/EMCEUROPE.2008.4786817","DOIUrl":null,"url":null,"abstract":"In this paper, a method for the investigation of the influence of a through-hole via on a printed circuit board power-bus is presented. Therefore based on an introduced via model for a through-hole via its scattering parameters are extracted using a de-embedding algorithm. After the following calculation of the via model elements with the two-port theory, the extracted impedances are inserted in a known formula for the power-bus impedance. In addition, it is shown how the signal return current acts as an excitation source of the waveguide modes within the power-bus.","PeriodicalId":133902,"journal":{"name":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","volume":"93 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"On the influence of vias on a PCB power-bus\",\"authors\":\"G. Heinrich, S. Dickmann\",\"doi\":\"10.1109/EMCEUROPE.2008.4786817\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a method for the investigation of the influence of a through-hole via on a printed circuit board power-bus is presented. Therefore based on an introduced via model for a through-hole via its scattering parameters are extracted using a de-embedding algorithm. After the following calculation of the via model elements with the two-port theory, the extracted impedances are inserted in a known formula for the power-bus impedance. In addition, it is shown how the signal return current acts as an excitation source of the waveguide modes within the power-bus.\",\"PeriodicalId\":133902,\"journal\":{\"name\":\"2008 International Symposium on Electromagnetic Compatibility - EMC Europe\",\"volume\":\"93 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Symposium on Electromagnetic Compatibility - EMC Europe\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCEUROPE.2008.4786817\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Symposium on Electromagnetic Compatibility - EMC Europe","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCEUROPE.2008.4786817","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this paper, a method for the investigation of the influence of a through-hole via on a printed circuit board power-bus is presented. Therefore based on an introduced via model for a through-hole via its scattering parameters are extracted using a de-embedding algorithm. After the following calculation of the via model elements with the two-port theory, the extracted impedances are inserted in a known formula for the power-bus impedance. In addition, it is shown how the signal return current acts as an excitation source of the waveguide modes within the power-bus.
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