用增材制造技术制造的一种电子小的三维立方体天线

I. Nassar, T. Weller
{"title":"用增材制造技术制造的一种电子小的三维立方体天线","authors":"I. Nassar, T. Weller","doi":"10.1109/RWS.2013.6486708","DOIUrl":null,"url":null,"abstract":"This paper presents the design of an electrically small, 3-D cube antenna that is fabricated using laser-based layer-by-Iayer stereolithography processing (SLA). The antenna consists of a balun and a half-wave dipole with meandered-line portions, all of which are patterned on the surface of a cube. The antenna operational frequency is 2.45 GHz and its measured 10 dB return loss bandwidth is 3.75%. Ka of the proposed design is 0.73 and its measured gain is -0.5 dBi. The gain is decreased by 2.5 dB compared with a previous prototype made with printed circuit board (PCB) technology using a commercial microwave substrate. However, the SLA fabrication approach significantly improves the manufacturing repeatability.","PeriodicalId":286070,"journal":{"name":"2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"146 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"38","resultStr":"{\"title\":\"An electrically-small, 3-D cube antenna fabricated with additive manufacturing\",\"authors\":\"I. Nassar, T. Weller\",\"doi\":\"10.1109/RWS.2013.6486708\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the design of an electrically small, 3-D cube antenna that is fabricated using laser-based layer-by-Iayer stereolithography processing (SLA). The antenna consists of a balun and a half-wave dipole with meandered-line portions, all of which are patterned on the surface of a cube. The antenna operational frequency is 2.45 GHz and its measured 10 dB return loss bandwidth is 3.75%. Ka of the proposed design is 0.73 and its measured gain is -0.5 dBi. The gain is decreased by 2.5 dB compared with a previous prototype made with printed circuit board (PCB) technology using a commercial microwave substrate. However, the SLA fabrication approach significantly improves the manufacturing repeatability.\",\"PeriodicalId\":286070,\"journal\":{\"name\":\"2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"volume\":\"146 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-03-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"38\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RWS.2013.6486708\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS.2013.6486708","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 38

摘要

本文介绍了一种电小的三维立方体天线的设计,该天线采用基于激光的逐层立体光刻工艺(SLA)制造。该天线由一个平衡天线和一个半波偶极子组成,它们都被绘制在一个立方体的表面上。天线工作频率为2.45 GHz,测得10db回波损耗带宽为3.75%。该设计的Ka为0.73,测量增益为-0.5 dBi。与先前使用商用微波衬底的印刷电路板(PCB)技术制作的原型相比,增益降低了2.5 dB。然而,SLA制造方法显著提高了制造的可重复性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An electrically-small, 3-D cube antenna fabricated with additive manufacturing
This paper presents the design of an electrically small, 3-D cube antenna that is fabricated using laser-based layer-by-Iayer stereolithography processing (SLA). The antenna consists of a balun and a half-wave dipole with meandered-line portions, all of which are patterned on the surface of a cube. The antenna operational frequency is 2.45 GHz and its measured 10 dB return loss bandwidth is 3.75%. Ka of the proposed design is 0.73 and its measured gain is -0.5 dBi. The gain is decreased by 2.5 dB compared with a previous prototype made with printed circuit board (PCB) technology using a commercial microwave substrate. However, the SLA fabrication approach significantly improves the manufacturing repeatability.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信