IBM 3081系统概述和技术

19th Design Automation Conference Pub Date : 1900-01-01 DOI:10.1145/800263.809190

C. Collins

{"title":"IBM 3081系统概述和技术","authors":"C. Collins","doi":"10.1145/800263.809190","DOIUrl":null,"url":null,"abstract":"The development of the IBM 3081 established the methodology for designinc and manufacturing a high-performance computer from an LSI chip technology. The high density packaging of the LSI chip is used to minimize interconnections and to support a fast machine cycle time. This paper will describe the methods used and will highlight some of the design problems that were solved, to offer an understanding of the challenges that LSI brings to the design cycle.","PeriodicalId":290739,"journal":{"name":"19th Design Automation Conference","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"IBM 3081 System Overview and Technology\",\"authors\":\"C. Collins\",\"doi\":\"10.1145/800263.809190\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The development of the IBM 3081 established the methodology for designinc and manufacturing a high-performance computer from an LSI chip technology. The high density packaging of the LSI chip is used to minimize interconnections and to support a fast machine cycle time. This paper will describe the methods used and will highlight some of the design problems that were solved, to offer an understanding of the challenges that LSI brings to the design cycle.\",\"PeriodicalId\":290739,\"journal\":{\"name\":\"19th Design Automation Conference\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th Design Automation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/800263.809190\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/800263.809190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

IBM 3081的开发建立了从大规模集成电路芯片技术设计和制造高性能计算机的方法。高密度封装的LSI芯片是用来减少互连和支持一个快速的机器周期时间。本文将描述所使用的方法，并将重点介绍一些已解决的设计问题，以提供对LSI给设计周期带来的挑战的理解。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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IBM 3081 System Overview and Technology

The development of the IBM 3081 established the methodology for designinc and manufacturing a high-performance computer from an LSI chip technology. The high density packaging of the LSI chip is used to minimize interconnections and to support a fast machine cycle time. This paper will describe the methods used and will highlight some of the design problems that were solved, to offer an understanding of the challenges that LSI brings to the design cycle.

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19th Design Automation Conference

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