77 GHz频段表面贴装陶瓷封装

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819231

S. Koriyama, K. Kitazawa, H. Minamiue, M. Fujii

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引用次数: 7

摘要

我们开发了一种用于77 GHz毫米波应用的陶瓷封装。该封装具有用于表面安装的新终端结构和用于电磁耦合的馈通。我们确认，表面安装封装显示高传输特性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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77 GHz band surface mountable ceramic package

We have developed a ceramic package for 77 GHz millimeter wave applications. The package has a new terminal structure for surface mount, and a feedthrough for electromagnetic coupling. We confirmed that the surface mounted package shows high transmission characteristics.

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来源期刊

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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