二氧化硅基载流子选择性前接触的24%高效PERC太阳能电池

Savita Kashyap, R. Pandey, Jaya Madan, Rajnish Sharma
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引用次数: 7

摘要

基于钝化发射极后接触(PERC)的太阳能电池由于其优越的光吸收性能,目前被认为是光伏(PV)工业大规模生产的有力竞争者。然而,如何以最小的接触复合损耗制造可行的PERC器件是一项具有挑战性的任务。因此,为了减少这一因素,在PERC器件中采用了多晶硅氧化物(POLO)作为载流子选择触点,并通过Silvaco-TCAD工具进行加工。在本工作中,采用了硅化物静电掺杂(ED)的概念,以避免在前表面的多晶硅(poly-Si)层中需要实际的物理掺杂。同时,研究分析了ErSi0.25 (3 eV)、ErSi0.82 (3.75 eV)和YbSi2 (3.95 eV)三种不同金属硅化物对n型ED区诱导的影响。通过PV参数、EBD、电流密度(J-V)曲线和EQE对PERC器件的整体性能进行了研究。在优化硅化物WF为3 eV时,ED-POLO PERC太阳能电池的短路电流密度(JSC)为40.86 mA/cm2,开路电压(VOC)为0.728 V,填充系数(FF)为80.76%,功率转换效率(PCE)为24.02%。硅化物在载流子选择性触点PERC器件中的研究为提高器件性能开辟了一条途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicide on Oxide Based Carrier Selective Front Contact for 24% Efficient PERC Solar Cell
Passivated emitter rear contact (PERC) based solar cells are currently regarded as a strong contender for large production in the photovoltaic (PV) industry owing to its superior light absorption properties. However, feasible fabrication of PERC devices with minimum contact recombination loss is a challenging task. Therefore, to diminish this factor, poly-silicon on oxide (POLO) as a carrier selective contact is employed in PERC device and processed through Silvaco-TCAD tool. In this proposed work, the concept of silicide electrostatically doped (ED) has been adopted to avoid the need for actual physical doping in polysilicon (poly-Si) layer on the front surface. Also, the impact of three different metal silicides such as ErSi0.25 (3 eV), ErSi0.82 (3.75 eV) and YbSi2 (3.95 eV) to induce the n-type ED region has been studied and analyzed. The overall performance of the PERC device is investigated with the help of PV parameters, EBD, current-density (J-V) curve and EQE. ED-POLO PERC solar cell reflects higher PV parameters such as short circuit current density (JSC) of 40.86 mA/cm2, open-circuit voltage (VOC) of 0.728 V, fill-factor (FF) of 80.76% and power conversion efficiency (PCE) of 24.02% at optimized silicide WF of 3 eV. The reported work of silicide in carrier selective contact-based PERC device may open a path to enhance the device performance.
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