450mm晶圆迁移的经济分析

Chen-Fu Chien, J.K. Wang, T. Chang, Wen-Chin Wu
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引用次数: 15

摘要

为了在摩尔定律的驱动下实现所需的持续成本降低,通过技术进步实现小型化和晶圆尺寸的增加,以保持半导体行业的增长和盈利能力。虽然已经对450毫米的迁移进行了一些技术分析,但很少有经济分析的研究来证明决策的合理性,从而建议450毫米迁移的适当时机。本研究旨在通过提出初步的经济分析来填补空白,以澄清一些神话,并促进有关利益相关者(包括设备供应商、客户和芯片制造商)之间合作的进一步讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Economic analysis of 450mm wafer migration
To achieve the required continuous cost reduction driven by Moore's Law, both miniaturization through technology advances and wafer size increase have been employed in order to maintain the growth and profitability of semiconductor industry. Although some technical analyses have been done for 450 mm migration, little research has been done on economic analysis to justify the decisions and thus suggest appropriate timing for 450 mm migration. This study aims to fill the gap by proposing a preliminary economic analysis to clarify some myths and facilitate further discussions concerning collaborations among the stakeholders including equipment vendors, customers, and chipmakers.
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