J. Pathak, H. Kurowski, R. Pugh, R. Shrivastava, F. Jenne
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引用次数: 4
摘要
快速可编程逻辑器件传统上是在双极熔断器技术中实现的。双极熔断器技术满足这些设备的速度要求,但有两个主要缺点:(1)显著更高的功耗,(2)熔断器技术不允许可重新编程和100%的可测试性。高速CMOS技术以及FAMOS器件的可靠性和可重编程性正在高速可编程逻辑设计中获得发展势头。一种19ns,低功率250mW, 44输入项和132产品项的可编程逻辑器件。介绍了2 ~ n阱CMOS EPROM技术。功率是等效双极元件的四分之一。N和P通道外围晶体管均采用自对准、浅结、轻掺杂漏极(LDD)。LDD结构减少了重叠电容,最大限度地减少了热电子注入。可编程元件是一个双晶体管FAMOS单元,针对速度和可编程性进行了优化;图1所示。单元格大小为133p2。编程特性如图2所示。该技术使用了一个反向偏置发生器,降低了寄生电容,提高了场阈值,从而更好地进行编程,并提供了大于200mA的锁存抗扰度。模具尺寸为3。LMM x 4.lmm;图3。典型的传播延迟为19ns,时钟到输出为lOns
FAST PROGRAMMABLE LOGIC DEVICES are traditionally implemented in the bipolar fuse technology. Bipolar fuse technology satisfies the speed requirement of these devices, but has two major disadvantages: ( I ) significantly higher power consumption and, (2) fuse technology does not allow reprogrammability and 100% testability. High-speed CMOS technology along with the demonstrated reliability and reprogrammability of FAMOS devices is gaining momentum in high-speed programmable logic design. A 19ns, low-power 250mW, 44-input term and 132 product term programmable logic device using 1 . 2 ~ N-well CMOS EPROM technology will be described. The power is one fourth of equivalent bipolar parts. Both the N and P channel peripheral transistors use self-aligned, shallow-junction, lightlydoped drains (LDD). The LDD structure reduces overlap capacitance and minimizes hot electron injection. The programmable element is a two-transistor FAMOS cell optimized for speed and programmability; Figure 1. The cell size is 133p2. The programming characteristic is shown in Figure 2. The technology uses a back bias generator, which reduces the parasitic capacitance, improves field threshold for better programming and provides latch up immunity greater than 200mA. The die size is 3.lmm x 4.lmm; Figure 3. Typical propagation delay of 19ns and clock to output of lOns