金属板包围单贴片的MSA阵列激励技术

W. Sarikha, P. Krachodnok, R. Wongsan
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引用次数: 0

摘要

本文研究了用金属板包裹的单片激励4×4矩形微带贴片天线(MSA)阵列的新技术。本研究的目的是探索一种新的微带阵列的激励技术,以取代传统的存在能量损耗和窄带带宽的相控线。从许多文献中,我们发现单块矩形MSA可以直接激发到它们并辐射到自由空间。然而,如果该贴片在同一层上被金属板包围,则其增益可以比仅使用单个贴片激发时增加更多。利用一般PCB设计了介电常数为2.2的金属板包围激励片。而4×4 MSA阵列则采用介电常数为4.4的FR4-PCB设计。两种PCB的基板厚度均为1.6 mm。利用CST软件仿真结果表明,在10 GHz工作频率下,天线的增益可从11.68 dB(无金属围板)提高到13.42 dB。然而,MSA阵列天线所需的辐射方向图可以通过一般的理论技术进行调整。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Exciting technique for MSA array by using single patch with surrounded metallic plate
This paper presents the study of new technique for exciting the 4×4 rectangular microstrip patches antenna (MSA) array by using a single patch, which is surrounded with metallic plate. The objective of this research is to explore the new technique for exciting any microstrip array instead of the conventional phasing line that have energy loss and narrow bandwidth occurred inside it. From many literatures, we found that the single patch of rectangular MSA can directly excite to them and reradiated to the free-space. However, if this patch is surrounded by metallic plate on the same layer, its gain can be increased more than using only single patch excited it. The exciting patch with surrounded metallic plate has been designed by using general PCB, which has the dielectric constant, equals to 2.2. While the 4×4 MSA array is designed by using FR4-PCB with dielectric constant equals to 4.4. The substrate thicknesses of both types of PCB are 1.6 mm. From the simulated results by using the licensed Computer Simulation Technology (CST) software, we found that the gain of antenna can be raised up from 11.68 dB (without metallic surrounded plate) to 13.42 dB at 10 GHz operating frequency. However, the required radiation patterns of MSA array antenna can be adjusted by using the general theoretical technique.
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