W. Hubbard, J. Lodico, H. Chan, M. Mecklenburg, B. Regan
{"title":"纳米尺度电导率映射:电介质击穿的实时成像与STEM EBIC","authors":"W. Hubbard, J. Lodico, H. Chan, M. Mecklenburg, B. Regan","doi":"10.1109/IPFA55383.2022.9915733","DOIUrl":null,"url":null,"abstract":"Dielectric breakdown (DB) is central to the failure and function of modern and next-generation computing components. Despite its importance in microelectronics, the specific mechanisms leading to DB are poorly understood. Electrical testing provides little spatial information about the small-scale effects that precede breakdown. High resolution imaging techniques, such as transmission electron microscopy (TEM), have the requisite resolution but are almost exclusively used to study the post-mortem effects of catastrophic DB. In this study we present techniques to directly visualize DB in nanoscale devices with scanning TEM electron beam-induced current (STEM EBIC) imaging. STEM EBIC imaging maps local conductivity and electric field with high contrast. In HfO2-based resistive memory (RRAM) devices, a data bit is stored as a conductive path formed via controlled, reversible DB. With STEM EBIC we image Ti/HfO2/Pt devices capable of switching repeatedly in situ. Distinct regions of soft and hard dielectric breakdown are observed at different phases of RRAM cycling. These results suggest a model where DB occurs on a progressive continuum between hard and soft breakdown.","PeriodicalId":378702,"journal":{"name":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Nanoscale Conductivity Mapping: Live Imaging of Dielectric Breakdown with STEM EBIC\",\"authors\":\"W. Hubbard, J. Lodico, H. Chan, M. Mecklenburg, B. Regan\",\"doi\":\"10.1109/IPFA55383.2022.9915733\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Dielectric breakdown (DB) is central to the failure and function of modern and next-generation computing components. Despite its importance in microelectronics, the specific mechanisms leading to DB are poorly understood. Electrical testing provides little spatial information about the small-scale effects that precede breakdown. High resolution imaging techniques, such as transmission electron microscopy (TEM), have the requisite resolution but are almost exclusively used to study the post-mortem effects of catastrophic DB. In this study we present techniques to directly visualize DB in nanoscale devices with scanning TEM electron beam-induced current (STEM EBIC) imaging. STEM EBIC imaging maps local conductivity and electric field with high contrast. In HfO2-based resistive memory (RRAM) devices, a data bit is stored as a conductive path formed via controlled, reversible DB. With STEM EBIC we image Ti/HfO2/Pt devices capable of switching repeatedly in situ. Distinct regions of soft and hard dielectric breakdown are observed at different phases of RRAM cycling. These results suggest a model where DB occurs on a progressive continuum between hard and soft breakdown.\",\"PeriodicalId\":378702,\"journal\":{\"name\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"73 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA55383.2022.9915733\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA55383.2022.9915733","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Nanoscale Conductivity Mapping: Live Imaging of Dielectric Breakdown with STEM EBIC
Dielectric breakdown (DB) is central to the failure and function of modern and next-generation computing components. Despite its importance in microelectronics, the specific mechanisms leading to DB are poorly understood. Electrical testing provides little spatial information about the small-scale effects that precede breakdown. High resolution imaging techniques, such as transmission electron microscopy (TEM), have the requisite resolution but are almost exclusively used to study the post-mortem effects of catastrophic DB. In this study we present techniques to directly visualize DB in nanoscale devices with scanning TEM electron beam-induced current (STEM EBIC) imaging. STEM EBIC imaging maps local conductivity and electric field with high contrast. In HfO2-based resistive memory (RRAM) devices, a data bit is stored as a conductive path formed via controlled, reversible DB. With STEM EBIC we image Ti/HfO2/Pt devices capable of switching repeatedly in situ. Distinct regions of soft and hard dielectric breakdown are observed at different phases of RRAM cycling. These results suggest a model where DB occurs on a progressive continuum between hard and soft breakdown.