金属脆性断裂中裂纹起源的微米尺度测量

Y. Yamaguchi, Y. Kato, K. Ogata
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引用次数: 2

摘要

本研究的目标是开发一种基于计算机视觉技术的微米尺度测量方法,用于测量金属脆性断裂中裂纹的起源和扩展。它是通过分析扫描电子显微镜(SEM)图像来完成的。在这里,脆性断裂是一种断裂,金属很少或没有塑性变形。在脆性断口的表面,许多被称为“解理步骤”的短条纹图案,从原点向外呈放射状扩散;因此,通过分析它们,可以测量裂纹的起源和扩展。在SEM图像中,解理步骤通常具有比背景更高的亮度;因此,可以使用图像处理技术提取它们并计算它们的位置和方向。通过对光滑和缺口试样的实验,证明了该方法的准确性。该方法有望使非专家也能在微米尺度上准确分析金属断裂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Micron Scale Measurement of a Crack Origin in a Metal Brittle Fracture
The goal of this research is to develop a micron scale measurement method, which, based on computer vision technology, gauges the crack origin and its extensions in a metal brittle fracture. It is performed by analyzing SEM, or Scanning Electron Microscope, images. Here, a brittle fracture is a kind of fractures, which accompanies little or no plastic deformations of the metal. On the surface of a brittle fracture, many short stripe patterns, which are called 'cleavage steps,' spread radially from the origin point towards outside; consequently, by analyzing them, the crack origin and extensions can be measured. The cleavage steps typically have higher brightness than the background in a SEM image; therefore, they can be extracted and their positions and orientations can be calculated using image processing techniques. By experiments with both smooth and notched specimens, our method is proved to work accurately. It is expected that our proposed method will enable non-experts to analyze metal fractures accurately in micron scale.
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