使用P-FIB快速简便的样品制备，减少了遮挡物

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2014-09-18 DOI:10.1109/IPFA.2014.6898159

S. Moreau, D. Bouchu, G. Audoit

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引用次数: 1

摘要

目前的方法建议在铣削相对较深的沟槽时使用等离子体fib来减少遮挡伪影。最后，该方法非常快(< 1小时)，设置简单，可以自动化。其目的在于通过明智的铣削消除或减少幕布工件的来源。这种方法可以很好地取代文献中提出的摇摆法。

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Fast and easy sample preparation with reduced curtaining artifacts using a P-FIB

The present methodology proposes to reduce curtaining artifacts using a plasma-FIB when milling relatively deep trenches. Finally, the methodology is very fast (<;1 h), simple to set up and can be automated. Its purpose consists in eliminating or reducing the origin of curtaining artifacts by judicious milling. This methodology can advantageously replace the rocking method presented in the literature.

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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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