消除恢复效应的NBTI表征新方法

M. Denais, V. Huard, C. Parthasarathy, G. Ribes, F. Perrier, N. Revil, A. Bravaix
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引用次数: 17

摘要

这项工作为先进CMOS技术中的负偏置温度不稳定性(NBTI)表征方法提供了新的见解。众所周知,NBTI严重限制了p沟道mosfet的电路性能,涉及到界面陷阱的产生和栅极氧化物中的空穴陷阱。在电参数提取过程中,氧化阱的空穴脱陷,也称为恢复现象,被一致认为是避免正确表征有效损伤的最关键现象。在此,我们指出了新的NBTI评估技术,利用栅极和漏极上的脉冲电压来表征NBT的退化并量化通常方法中的恢复效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New methodologies of NBTI characterization eliminating recovery effects
This work gives new insights of negative bias temperature instability (NBTI) characterization methodologies in advanced CMOS technology. NBTI is well-known to seriously limit the circuit performances in p-channel MOSFETs, in relation to both interface trap generation and hole trapping in the gate oxide. Hole detrapping from oxide traps during electrical parameter extractions, also called a recovery phenomenon, is unanimously acknowledged to be the most critical phenomenon avoiding a proper characterization of the effective damage. We point out here new NBTI evaluation techniques using pulsed voltages on the gate and on the drain to characterize NBT degradation and quantify recovery effects in the usual methodology.
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