{"title":"一种晶圆级视觉-热转换器","authors":"M. Syrzycki, L. Carr, G. Chapman, M. Parameswaran","doi":"10.1109/ICWSI.1993.255279","DOIUrl":null,"url":null,"abstract":"Wafer scale transducer arrays (WSTAs) containing multi-transducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers, together with signal conditioning and control circuitry. The WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing.<<ETX>>","PeriodicalId":377227,"journal":{"name":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"A wafer scale visual-to-thermal converter\",\"authors\":\"M. Syrzycki, L. Carr, G. Chapman, M. Parameswaran\",\"doi\":\"10.1109/ICWSI.1993.255279\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wafer scale transducer arrays (WSTAs) containing multi-transducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers, together with signal conditioning and control circuitry. The WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing.<<ETX>>\",\"PeriodicalId\":377227,\"journal\":{\"name\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-01-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1993.255279\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1993.255279","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wafer scale transducer arrays (WSTAs) containing multi-transducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers, together with signal conditioning and control circuitry. The WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing.<>