Value added technology development on microinterconnect flex circuit

To develop a conductive polymer formulation which can be printed through an automatic reel-to-reel process to form a thin film (0.1 to 25 /spl mu/m) on insulated materials. The materials can be but not limited to, polymers, engineering plastic, ceramics, glasses, fibers, hard coating layers, especially on microinterconnect flex circuits (1 to 10 mil in total thickness with or without organic cover coating materials) made from polyimide or LCP (Liquid crystal polymers) substrates. A thin conductive film will significantly reduce surface resistivity of the coated surfaces to a range of 10E5 to 10 E9 ohms. The thickness of the film can be adjusted through a cliche design (Pad printing) with a dimensional alignment control at +/- 10-20%, or through mesh design by using screen-printing technique when there is a need in covering small features (200 /spl mu/m). The printing process is a reel-to-reel high volume-manufacturing line. To develop an Reel-To-Reel automatic solder ball (100 to 700,/spl mu/m)jetting process for the thin film microinterconnect flex circuits (1 to 10 mil) in supporting advance flex circuit application for Chip on Flex (COF), Chip On Suspension (COS), Piezo elements (PZT) Attachment, especially on FSA/HGA manufacturing (Flex Suspension Assembly, and Head Gimbal Assembly).