{"title":"无线互连片上天线的金属干扰分析及设计原则","authors":"Xiaowei He, Minxuan Zhang, Jinwen Li, Shaoqing Li","doi":"10.1109/ISSSE.2010.5607064","DOIUrl":null,"url":null,"abstract":"The influence of on-chip metal interconnections, power grids, heat sink together with packaging, and metal dummy fills on the transmission characteristics of a 2mm-long integrated dipole antenna pair has been investigated in this paper. These metal structures and placements have been classified and particular simulations are performed to explore the interference effects of neighboring various metal structures on transmission gain, phase, impedance and radiation pattern for on-chip dipole antenna pair. By virtue of the experimental results and analyses, several experiential linear expressions for antenna pair gain and phase in interference circumstances are obtained using numerical fit. A set of design rules is concluded accordingly for guiding on-chip antenna layout and design targeting wireless interconnect.","PeriodicalId":211786,"journal":{"name":"2010 International Symposium on Signals, Systems and Electronics","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Metal interference analysis and design rules of on-chip antennas for wireless interconnect\",\"authors\":\"Xiaowei He, Minxuan Zhang, Jinwen Li, Shaoqing Li\",\"doi\":\"10.1109/ISSSE.2010.5607064\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The influence of on-chip metal interconnections, power grids, heat sink together with packaging, and metal dummy fills on the transmission characteristics of a 2mm-long integrated dipole antenna pair has been investigated in this paper. These metal structures and placements have been classified and particular simulations are performed to explore the interference effects of neighboring various metal structures on transmission gain, phase, impedance and radiation pattern for on-chip dipole antenna pair. By virtue of the experimental results and analyses, several experiential linear expressions for antenna pair gain and phase in interference circumstances are obtained using numerical fit. A set of design rules is concluded accordingly for guiding on-chip antenna layout and design targeting wireless interconnect.\",\"PeriodicalId\":211786,\"journal\":{\"name\":\"2010 International Symposium on Signals, Systems and Electronics\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 International Symposium on Signals, Systems and Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSSE.2010.5607064\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 International Symposium on Signals, Systems and Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSSE.2010.5607064","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Metal interference analysis and design rules of on-chip antennas for wireless interconnect
The influence of on-chip metal interconnections, power grids, heat sink together with packaging, and metal dummy fills on the transmission characteristics of a 2mm-long integrated dipole antenna pair has been investigated in this paper. These metal structures and placements have been classified and particular simulations are performed to explore the interference effects of neighboring various metal structures on transmission gain, phase, impedance and radiation pattern for on-chip dipole antenna pair. By virtue of the experimental results and analyses, several experiential linear expressions for antenna pair gain and phase in interference circumstances are obtained using numerical fit. A set of design rules is concluded accordingly for guiding on-chip antenna layout and design targeting wireless interconnect.
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