{"title":"MCM-L上新型同轴传输线结构研究","authors":"A. Thiel, C. Habiger, G. Troster","doi":"10.1109/MCMC.1997.569343","DOIUrl":null,"url":null,"abstract":"This paper presents recent investigations on a novel transmission line structure with improved RF-performance and increased shielding capability based on MCM-L interconnect technology. Three key issues are addressed: Maximization of usable interconnect bandwidth, reproducibility of the characteristic electrical properties in large-volume production, and minimization of inter-signal and electromagnetic interference. Thanks to recent improvements of MCM-L technology this new structure is processable in a cost-effective roll-to-roll production cycle. The electrical properties of the new structure are deduced from the well-known coaxial and triplate transmission line models. Furthermore, FEM-simulation results provide an estimation of the limitations of the proposed structure, which are caused by conductor and dielectric losses. The design of a test-vehicle intended for verification of the simulation results is presented. And finally, measurement results obtained from TDR/TDT and VNA measurement setups are reported and compared to the theoretical estimations.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"208 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Investigations on novel coaxial transmission line structures on MCM-L\",\"authors\":\"A. Thiel, C. Habiger, G. Troster\",\"doi\":\"10.1109/MCMC.1997.569343\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents recent investigations on a novel transmission line structure with improved RF-performance and increased shielding capability based on MCM-L interconnect technology. Three key issues are addressed: Maximization of usable interconnect bandwidth, reproducibility of the characteristic electrical properties in large-volume production, and minimization of inter-signal and electromagnetic interference. Thanks to recent improvements of MCM-L technology this new structure is processable in a cost-effective roll-to-roll production cycle. The electrical properties of the new structure are deduced from the well-known coaxial and triplate transmission line models. Furthermore, FEM-simulation results provide an estimation of the limitations of the proposed structure, which are caused by conductor and dielectric losses. The design of a test-vehicle intended for verification of the simulation results is presented. And finally, measurement results obtained from TDR/TDT and VNA measurement setups are reported and compared to the theoretical estimations.\",\"PeriodicalId\":412444,\"journal\":{\"name\":\"Proceedings 1997 IEEE Multi-Chip Module Conference\",\"volume\":\"208 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-02-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1997 IEEE Multi-Chip Module Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1997.569343\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1997 IEEE Multi-Chip Module Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1997.569343","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigations on novel coaxial transmission line structures on MCM-L
This paper presents recent investigations on a novel transmission line structure with improved RF-performance and increased shielding capability based on MCM-L interconnect technology. Three key issues are addressed: Maximization of usable interconnect bandwidth, reproducibility of the characteristic electrical properties in large-volume production, and minimization of inter-signal and electromagnetic interference. Thanks to recent improvements of MCM-L technology this new structure is processable in a cost-effective roll-to-roll production cycle. The electrical properties of the new structure are deduced from the well-known coaxial and triplate transmission line models. Furthermore, FEM-simulation results provide an estimation of the limitations of the proposed structure, which are caused by conductor and dielectric losses. The design of a test-vehicle intended for verification of the simulation results is presented. And finally, measurement results obtained from TDR/TDT and VNA measurement setups are reported and compared to the theoretical estimations.