Y. Araga, Ranto Miura, M. Nagata, C. Neve, J. de Vos, G. van der Plas, E. Beyne
{"title":"基于动态电源电流仿真和功率噪声监测的三维芯片堆栈电源完整性研究","authors":"Y. Araga, Ranto Miura, M. Nagata, C. Neve, J. de Vos, G. van der Plas, E. Beyne","doi":"10.1109/ESTC.2014.6962728","DOIUrl":null,"url":null,"abstract":"A 3D-integrated test vehicle that emulates noise generation and propagation in a heterogeneous integrated system has been developed. In-stack waveform capturers are embedded on each tier which captured the generation and propagation of noise. A consistent analytical model is created and analysis using that model has allowed us to develop a design strategy for the power delivery network to attenuate noise propagation in the stacked system.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A study on power integrity in a 3D chip stack using dynamic power supply current emulation and power noise monitoring\",\"authors\":\"Y. Araga, Ranto Miura, M. Nagata, C. Neve, J. de Vos, G. van der Plas, E. Beyne\",\"doi\":\"10.1109/ESTC.2014.6962728\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 3D-integrated test vehicle that emulates noise generation and propagation in a heterogeneous integrated system has been developed. In-stack waveform capturers are embedded on each tier which captured the generation and propagation of noise. A consistent analytical model is created and analysis using that model has allowed us to develop a design strategy for the power delivery network to attenuate noise propagation in the stacked system.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"81 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962728\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962728","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A study on power integrity in a 3D chip stack using dynamic power supply current emulation and power noise monitoring
A 3D-integrated test vehicle that emulates noise generation and propagation in a heterogeneous integrated system has been developed. In-stack waveform capturers are embedded on each tier which captured the generation and propagation of noise. A consistent analytical model is created and analysis using that model has allowed us to develop a design strategy for the power delivery network to attenuate noise propagation in the stacked system.