半导体指标:目标冲突还是机会增加?

L. Sattler, R. Schlueter
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引用次数: 19

摘要

为了提高半导体制造性能,公司通常使用各种指标,如周期时间、吞吐量和良率。通过跟踪这些指标中的一个或多个的进展并设置成就目标,许多公司能够做出重大的指标改进。然而,度量改进只有在实际生产改进的情况下才是有益的。度量标准可能受到制造外部力量的影响,它们可能与其他度量标准相冲突,或者它们实际上可能增加晶圆厂的不良结果。本文重点介绍了目前在半导体晶圆厂中使用公制的一些问题。本文给出了来自工业界的例子和使用加州大学伯克利分校“竞争性半导体制造研究”数据的结果。我们提出了一些实用的解决方案,重点介绍了德州仪器的整体设备效率团队,该团队旨在最大限度地减少许多半导体度量问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Semiconductor metrics: conflicting goals or increasing opportunities?
In order to improve semiconductor manufacturing performance, companies typically utilize various metrics such as cycle time, throughput and yield. By tracking the progress of one or more of these metrics and setting achievement goals, many companies are able to make significant metric improvements. However, metric improvement is only beneficial if it results in actual manufacturing improvement. Metrics may be influenced by forces outside manufacturing, they may conflict with other metrics, or they may actually increase undesirable outcomes in the fab. This paper highlights some of the current problems with metric utilization in semiconductor fabs. Examples from industry and results using data from the Competitive Semiconductor Manufacturing Study at the University of California at Berkeley are given. We present some practical solutions, highlighting the Overall Equipment Effectiveness Teams at Texas Instruments which have been designed to minimize many of the semiconductor metric problems.
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