利用能量平衡模型分析了Cu膜/DFR/Ni镀液三倍时微屋檐的形成

Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387) Pub Date : 2000-07-11 DOI:10.1109/IMNC.2000.872636

H. Yoshida, T. Nakamura, Y. Kawakami, A. Kawai

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引用次数: 0

摘要

DFR(干膜光刻胶)广泛应用于微镀工艺。然而，由于液体侵入基板/DFR界面，在电镀图案底部形成鸟喙状的“屋檐”。本报告的目的是通过分析基材/DFR/液体的三倍粘附能来阐明“屋檐”形成的机制。

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Formation of micro eaves analyzed by energy balance model at threefold of Cu film/DFR/Ni plating solution

DFR (Dry Film Photoresist) is widely used mainly in micro plating process. However as the result of liquid intrusion into substrate/DFR interface, a bird's-beak like "eaves" is formed at bottom of a plating pattern. The purpose of this presentation is to clarify the mechanism of the "eaves" formation by analyzing adhesion energies at the substrate/DFR/liquids threefold.

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Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)

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