飞秒激光烧蚀薄硅衬底钻孔过程的时间分辨成像及其分析

CLEO/Europe. 2005 Conference on Lasers and Electro-Optics Europe, 2005. Pub Date : 2005-06-17 DOI:10.1109/CLEOE.2005.1568444

A. Yokotani, T. Mukumoto, K. Kurosawa, T. Ninomiya, H. Sawada

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引用次数: 0

摘要

本文对飞秒激光在硅表面的钻孔过程进行了观察和分析，以研究薄硅衬底切割过程中的热效应程度

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Time-resolving imaging and its analysis of drilling process of thin silicon substrates with femtosecond laser ablation

In this paper, we have observed and analyzed the drilling process with femtosecond laser on the silicon surface in order to investigate a degree of thermal effect during the dicing process of the thin silicon substrate

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来源期刊

CLEO/Europe. 2005 Conference on Lasers and Electro-Optics Europe, 2005.

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