晶体管的“二次击穿”

H. Schafft, J. French
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引用次数: 66

摘要

晶体管中的“二次击穿”的特征是当晶体管扫过其vcev的集成电路特性时,在IM指定的集电极电流下,VCE突然降低。对有关这一现象的文献进行了批判性的回顾,并对其特征进行了更完整的描述。“二次击穿”似乎是晶体管的一个比以前认为的更基本的特性。迄今为止,文献中考虑的每一种机制,特别是“夹紧”效应和p-n-p-n作用,都经过了研究,发现不足。这种现象的发生明显依赖于吸收的能量和周围的温度,这表明它可能与某种热机制有关。这指出了从能量耗散的角度来检查“二次击穿”的重要性,而不是像迄今为止所做的那样从电压或电流的角度来检查。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
"Second breakdown" in transistors
"Second breakdown" in transistors has been characterized as an abrupt reduction in VCE, at a collector current designated by IM, when the transistor is swept through its VCEvs ICcharacteristics. A critical review of the literature concerning this phenomenon and a more complete description of its characteristics are given. It appears that "second breakdown" is a more fundamental property of the transistor than has previously been thought. Each of the mechanisms thus far considered in the literature, in particular the "pinch-in" effect and p-n-p-n action, has been examined and found inadequate. The apparent dependence of the initiation of the phenomenon on the quantity of energy absorbed, and on the ambient temperature, indicates that it may be related to some thermal mechanism. This points to the importance of examining "second breakdown" in terms of energy dissipated rather than in terms of voltage or current as has been done to date.
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