{"title":"EDFAS虚拟研讨会亮点","authors":"D. Grosjean","doi":"10.31399/asm.edfa.2021-1.p050","DOIUrl":null,"url":null,"abstract":"\n This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"EDFAS Virtual Workshop Highlights\",\"authors\":\"D. Grosjean\",\"doi\":\"10.31399/asm.edfa.2021-1.p050\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2021-1.p050\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2021-1.p050","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.
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