{"title":"三维片上网络中的消息路由","authors":"C. Rusu, L. Anghel, D. Avresky","doi":"10.1109/NORCHP.2009.5397855","DOIUrl":null,"url":null,"abstract":"Nowadays 3D chips are fabricated by stacking 2D layers and manufacturing vertical links between them. In this paper we present a routing scheme suited for 3D networks-on-chip (NoCs). It is based on the reuse of existing routing schemes for 2D NoCs. Our 3D scheme is scalable and can be used with any 2D topology. The effectiveness of the scheme for intra-layer communication is given by the respective 2D routing scheme of each layer, while for the inter-layer communication the scheme can always find a route between any source and destination, if there is one available.","PeriodicalId":308859,"journal":{"name":"2009 NORCHIP","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Message routing in 3D networks-on-chip\",\"authors\":\"C. Rusu, L. Anghel, D. Avresky\",\"doi\":\"10.1109/NORCHP.2009.5397855\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nowadays 3D chips are fabricated by stacking 2D layers and manufacturing vertical links between them. In this paper we present a routing scheme suited for 3D networks-on-chip (NoCs). It is based on the reuse of existing routing schemes for 2D NoCs. Our 3D scheme is scalable and can be used with any 2D topology. The effectiveness of the scheme for intra-layer communication is given by the respective 2D routing scheme of each layer, while for the inter-layer communication the scheme can always find a route between any source and destination, if there is one available.\",\"PeriodicalId\":308859,\"journal\":{\"name\":\"2009 NORCHIP\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 NORCHIP\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NORCHP.2009.5397855\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 NORCHIP","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NORCHP.2009.5397855","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Nowadays 3D chips are fabricated by stacking 2D layers and manufacturing vertical links between them. In this paper we present a routing scheme suited for 3D networks-on-chip (NoCs). It is based on the reuse of existing routing schemes for 2D NoCs. Our 3D scheme is scalable and can be used with any 2D topology. The effectiveness of the scheme for intra-layer communication is given by the respective 2D routing scheme of each layer, while for the inter-layer communication the scheme can always find a route between any source and destination, if there is one available.
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