熔融轴对称焊点的启发式力-高度方程

L.S. Goldman
{"title":"熔融轴对称焊点的启发式力-高度方程","authors":"L.S. Goldman","doi":"10.1109/ECTC.1993.346694","DOIUrl":null,"url":null,"abstract":"A heuristic equation is developed which relates the height of a molten joint to its surface tension, geometric constraints, and the applied force. In its present state, the equation is valid only for heights varying up to 10% from the zero-load shape, although a method is suggested to extend this range. The equation agrees well with published data derived from an exact solution, and with the data from a small laboratory experiment. The equation is intended as a practical tool for packaging engineers and designers who do not have access to the software needed to obtain the exact solution.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"A heuristic force-height equation for molten axisymmetric solder joints\",\"authors\":\"L.S. Goldman\",\"doi\":\"10.1109/ECTC.1993.346694\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A heuristic equation is developed which relates the height of a molten joint to its surface tension, geometric constraints, and the applied force. In its present state, the equation is valid only for heights varying up to 10% from the zero-load shape, although a method is suggested to extend this range. The equation agrees well with published data derived from an exact solution, and with the data from a small laboratory experiment. The equation is intended as a practical tool for packaging engineers and designers who do not have access to the software needed to obtain the exact solution.<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346694\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346694","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12

摘要

建立了一个启发式方程,将熔化接头的高度与其表面张力、几何约束和施加的力联系起来。在其目前的状态下,该方程仅适用于从零载荷形状变化高达10%的高度,尽管提出了一种方法来扩大这一范围。该方程与已发表的精确解的数据以及小型实验室实验的数据非常吻合。对于没有获得精确解所需的软件的包装工程师和设计师来说,这个方程是一个实用的工具
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A heuristic force-height equation for molten axisymmetric solder joints
A heuristic equation is developed which relates the height of a molten joint to its surface tension, geometric constraints, and the applied force. In its present state, the equation is valid only for heights varying up to 10% from the zero-load shape, although a method is suggested to extend this range. The equation agrees well with published data derived from an exact solution, and with the data from a small laboratory experiment. The equation is intended as a practical tool for packaging engineers and designers who do not have access to the software needed to obtain the exact solution.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信