提高集群网格FPGA中开关盒的鲁棒性

Arwa Ben Dhia, M. Slimani, L. Naviner
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引用次数: 0

摘要

随着CMOS特征尺寸的不断缩小,制造缺陷在微电子和纳米电子学领域日益受到关注。这项工作涉及fpga的缺陷容忍度,这肯定会受到技术缩减的影响。在本文中,我们感兴趣的是在降低硬化成本的同时,增强集群网格FPGA中开关箱的缺陷容忍度。首先,我们必须在开关箱多路复用器中找出最适合加固的一个。然后,我们通过组装来自65nm工业库的不同标准单元,为后者构建了不同的可能架构。这些体系结构是在单一缺陷注入的情况下通过一个工具来研究的,该工具根据其提取的网络列表对给定设计的几个可能的缺陷进行建模。最终,选择了最健壮的体系结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improving the robustness of a switch box in a mesh of clusters FPGA
As CMOS feature sizes are shrinking, manufacturing defects are becoming a growing concern in micro and nanoelectronics. This work deals with defect tolerance in FPGAs that are surely affected by technology downscaling. In this paper, we are interested in enhancing the defect tolerance of a switch box in a mesh of clusters FPGA, while trying to reduce the hardening cost. First, we had to spot, among the switch box multiplexers, the most eligible one to be hardened. Then, we built different possible architectures for the latter by assembling different standard cells from a 65nm industrial library. These architectures were studied under single defect injection by a tool that models several possible defects for a given design according to its extracted netlist. Eventually, the most robust architecture was picked.
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