Hyun-Seung Lee, Eun-Gyu Lee, Ji-Hoon Kim, H. Ko, Choul‐Young Kim
{"title":"用于机器人应用的24GHz多普勒雷达传感器","authors":"Hyun-Seung Lee, Eun-Gyu Lee, Ji-Hoon Kim, H. Ko, Choul‐Young Kim","doi":"10.1109/ICCAS.2013.6704147","DOIUrl":null,"url":null,"abstract":"A compact 24 GHz quadrature Doppler radar front-end module was fabricated using LTCC packaging technology. A method involving the vertical stacking of a three-dimensional LTCC packaging module and an FR-4 substrate was developed, and a compact 24 GHz quadrature Doppler radar front-end module was fabricated.","PeriodicalId":415263,"journal":{"name":"2013 13th International Conference on Control, Automation and Systems (ICCAS 2013)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"24GHz Doppler radar sensor for robotic applications\",\"authors\":\"Hyun-Seung Lee, Eun-Gyu Lee, Ji-Hoon Kim, H. Ko, Choul‐Young Kim\",\"doi\":\"10.1109/ICCAS.2013.6704147\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A compact 24 GHz quadrature Doppler radar front-end module was fabricated using LTCC packaging technology. A method involving the vertical stacking of a three-dimensional LTCC packaging module and an FR-4 substrate was developed, and a compact 24 GHz quadrature Doppler radar front-end module was fabricated.\",\"PeriodicalId\":415263,\"journal\":{\"name\":\"2013 13th International Conference on Control, Automation and Systems (ICCAS 2013)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 13th International Conference on Control, Automation and Systems (ICCAS 2013)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAS.2013.6704147\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 13th International Conference on Control, Automation and Systems (ICCAS 2013)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAS.2013.6704147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
24GHz Doppler radar sensor for robotic applications
A compact 24 GHz quadrature Doppler radar front-end module was fabricated using LTCC packaging technology. A method involving the vertical stacking of a three-dimensional LTCC packaging module and an FR-4 substrate was developed, and a compact 24 GHz quadrature Doppler radar front-end module was fabricated.