碳掺杂优化缓冲层以提高GaN hemt的性能

Ajay Shanbhag, P. SruthiM., F. Medjdoub, A. Chakravorty, N. Dasgupta, A. DasGupta
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引用次数: 1

摘要

本文重点从亚阈值斜率$(SS)$、击穿电压$(V_{BD})$和传输频率$(f_{t})$三个方面来确定缓冲器中碳掺杂水平的优化值和相应的沟道厚度,以提高GaN hemt的性能。随着碳掺杂量的增加,我们观察到$SS$和$V_{BD}$有所提高,而$f_{t}$有所降低。然而,当通道厚度增加到一定厚度以上时,碳掺杂对其特性没有显著影响。在通道厚度为500 nm的缓冲液中,碳掺杂水平为$3\ × 10^{18}cm^{-3}$的器件,使用实验数据对TCAD模拟进行了校准。在TCAD中使用校准后的装置,改变碳掺杂水平和通道厚度,观察不同参数对其的影响。我们观察到,在缓冲液中碳掺杂水平为$1\ × 10^{19}cm^{-3}$时,优化的通道厚度为200 nm,在$V_{BD}$和$f_{t}$方面获得了最佳效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimized Buffer Stack with Carbon-Doping for Performance Improvement of GaN HEMTs
This paper focuses on determining an optimized value of carbon-doping level in the buffer and corresponding channel thickness to improve the performance of GaN HEMTs in terms of subthreshold slope $(SS)$, breakdown voltage $(V_{BD})$ and transit frequency $(f_{t})$. With the increase in carbon-doping, we observe improvements in $SS$ and $V_{BD}$ while the $f_{t}$ is reduced. However, as the channel thickness increases above a certain thickness, no significant impact of carbon-doping is observed on the characteristics. TCAD simulation is calibrated using experimental data for a device with carbon-doping level of $3\times 10^{18}cm^{-3}$ in the buffer with channel thickness of 500 nm. Using the calibrated device in TCAD, the carbon-doping level and channel thickness are varied to see the effects on different parameters. We observed that an optimized channel thickness of 200 nm with carbon-doping level of $1\times 10^{19}cm^{-3}$ in the buffer yields the best results in terms of $V_{BD}$ and $f_{t}$.
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