用TSD技术去除嵌入微带不连续s参数测量的可重复性问题

L. Dunleavy, P. Katehi
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引用次数: 3

摘要

连接的可重复性是毫米波去嵌入的关键问题。无论采用何种去嵌入方案,用于夹具表征的标准的电气连接必须是可重复的,并且与被测设备的连接相似。讨论了与“TSD”(通过短延迟)技术测量微带不连续性相关的关键可重复性问题。这些包括同轴/微带连接的可重复性,微带/微带互连,微带线制造和衬底安装,以及同轴到微带转换(发射器)的电气特性。这些问题都已经在实验中进行了探讨,并给出了两种类型的同轴-微带测试夹具的结果:一种可用于2至18GHz,另一种可用于2至40GHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Repeatability Issues for De-Embedding Microstrip Discontinuity S-Parameter Measurements by the TSD Technique
Connection repeatability is a critical issue for millimeter-wave de-embedding. Regardless of the de-embedding scheme, the electrical connections made to standards used for fixture characterization must be repeatable and similar to those made to the device under test. Key repeatability issues related to the measurement of microstrip discontinuities with the "TSD" (thru-short-delay) technique are discussed. These include the repeatability of coax/microstrip connections, microstrip/microstrip interconnects, microstrip line fabrication and substrate mounting, and the electrical characteristics of coax-to-microstrip transitions (launchers). Each of these issues has been explored experimentally and the results are presented for two types of coaxial-to-microstrip test fixtures: one usable from 2 to 18GHz, and the other from 2 to 40GHz.
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