具有单个时钟树实现的主克隆放置-物理芯片设计的一个案例

O. Schrape, A. Balashov, A. Simevski, Carlos Benito, M. Krstic
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引用次数: 0

摘要

提出了一种分层物理实现设计流程的混合设计方法,并在一个容错低功耗多处理器系统上进行了演示。建议的流允许与相反的需求(如相同的位置和单独的块实现)并行地实现选定的子模块。整个系统包含四个Leon2内核,通过Waterbear框架进行通信,并支持自适应电压缩放(AVS)功能。三种处理器内核变体源自第一个基准参考内核,但基于它们的时钟树规范在块级单独实现。该芯片是为空间应用而准备的,并为控制部件设计了三模冗余(TMR)。低功耗性能是通过现代电源和时钟管理控制实现的。ASIC是在低功耗$0.13 \mu \math {m}$ BiCMOS工艺节点上制造的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Master-Clone Placement with Individual Clock Tree Implementation – a Case on Physical Chip Design
A hybrid design approach of the hierarchical physical implementation design flow is presented and demonstrated on a fault-tolerant low-power multiprocessor system. The proposed flow allows to implement selected submodules in parallel with contrary requirements such as identical placement and individual block implementation. The overall system contains four Leon2 cores and communicates via the Waterbear framework and supports Adaptive Voltage Scaling (AVS) functionality. Three of the processor core variants are derived from the first baseline reference core but implemented individually at block level based on their clock tree specification. The chip is prepared for space applications and designed with triple modular redundancy (TMR) for control parts. The low-power performance is enabled by contemporary power and clock management control. An ASIC is fabricated in a low-power $0.13 \mu \mathrm{m}$ BiCMOS technology process node.
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