{"title":"硅光子中间体中定向耦合器的氧化通孔(TOV)诱导制造应力","authors":"E. C. Graham, Nicholas M. Fahrenkopf, N. Cady","doi":"10.1109/ANS47466.2019.8963742","DOIUrl":null,"url":null,"abstract":"To study how though- oxide-via (TOV) induced stress affects light propagation, a numerical model is constructed using the commercially available finite element analysis (FEA) software COMSOL Multiphysics 5.4a. In the model, directional couplers are used to analyze wavelength shifts as TOV structures are placed at varying distances away. Increasing the number of TOVs in proximity to directional couplers is also explored. Finally, determining the need for a keep-out-zone is assesed for directional couplers fabricated in a silicon photonic interposer.","PeriodicalId":375888,"journal":{"name":"2019 IEEE Albany Nanotechnology Symposium (ANS)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Through Oxide Via (TOV) Induced Fabrication Stress on Directional Couplers in a Si Photonic Interposer\",\"authors\":\"E. C. Graham, Nicholas M. Fahrenkopf, N. Cady\",\"doi\":\"10.1109/ANS47466.2019.8963742\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To study how though- oxide-via (TOV) induced stress affects light propagation, a numerical model is constructed using the commercially available finite element analysis (FEA) software COMSOL Multiphysics 5.4a. In the model, directional couplers are used to analyze wavelength shifts as TOV structures are placed at varying distances away. Increasing the number of TOVs in proximity to directional couplers is also explored. Finally, determining the need for a keep-out-zone is assesed for directional couplers fabricated in a silicon photonic interposer.\",\"PeriodicalId\":375888,\"journal\":{\"name\":\"2019 IEEE Albany Nanotechnology Symposium (ANS)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE Albany Nanotechnology Symposium (ANS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ANS47466.2019.8963742\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE Albany Nanotechnology Symposium (ANS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ANS47466.2019.8963742","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Through Oxide Via (TOV) Induced Fabrication Stress on Directional Couplers in a Si Photonic Interposer
To study how though- oxide-via (TOV) induced stress affects light propagation, a numerical model is constructed using the commercially available finite element analysis (FEA) software COMSOL Multiphysics 5.4a. In the model, directional couplers are used to analyze wavelength shifts as TOV structures are placed at varying distances away. Increasing the number of TOVs in proximity to directional couplers is also explored. Finally, determining the need for a keep-out-zone is assesed for directional couplers fabricated in a silicon photonic interposer.
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