耦合微带线中高速信号的电学性能

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI:10.1109/EPEPS.2011.6100190

D. Kostka, A. Scogna, Frank Paglia, B. Mutnury

{"title":"耦合微带线中高速信号的电学性能","authors":"D. Kostka, A. Scogna, Frank Paglia, B. Mutnury","doi":"10.1109/EPEPS.2011.6100190","DOIUrl":null,"url":null,"abstract":"The electrical performance of high speed signaling in coupled differential microstrip lines is analyzed. Based on the modal decomposition analysis, the cancellation frequency in the single-ended insertion loss response is explained and a closed formula is presented for the prediction of such resonant frequencies. Sensitivity analyses are also performed in order to investigate the impact of the solder mask layer and the differential microstrip geometry on the cancellation frequency.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Electrical performance of high speed signaling in coupled microstrip lines\",\"authors\":\"D. Kostka, A. Scogna, Frank Paglia, B. Mutnury\",\"doi\":\"10.1109/EPEPS.2011.6100190\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The electrical performance of high speed signaling in coupled differential microstrip lines is analyzed. Based on the modal decomposition analysis, the cancellation frequency in the single-ended insertion loss response is explained and a closed formula is presented for the prediction of such resonant frequencies. Sensitivity analyses are also performed in order to investigate the impact of the solder mask layer and the differential microstrip geometry on the cancellation frequency.\",\"PeriodicalId\":313560,\"journal\":{\"name\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2011.6100190\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

分析了耦合差分微带线高速信号的电学性能。基于模态分解分析，解释了单端插入损耗响应中的抵消频率，并给出了该谐振频率预测的封闭公式。为了研究阻焊层和差分微带几何形状对抵消频率的影响，还进行了灵敏度分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Electrical performance of high speed signaling in coupled microstrip lines

The electrical performance of high speed signaling in coupled differential microstrip lines is analyzed. Based on the modal decomposition analysis, the cancellation frequency in the single-ended insertion loss response is explained and a closed formula is presented for the prediction of such resonant frequencies. Sensitivity analyses are also performed in order to investigate the impact of the solder mask layer and the differential microstrip geometry on the cancellation frequency.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

自引率

0.00%

发文量