用简单脉冲电流应力技术评价铜互连的电迁移和应力迁移可靠性

Proceedings of IEEE International Electron Devices Meeting Pub Date : 1993-12-05 DOI:10.1109/IEDM.1993.347354

H. Yamada, T. Hoshi, T. Takewaki, T. Shibata, T. Ohmi, T. Nitta

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引用次数: 8

摘要

通过使用简单的脉冲电流应力技术，我们已经证明了可以非常有效地分别评估大晶粒铜互连的电迁移和应力迁移电阻。从这些寿命试验的结果来看，铜互连的可靠性主要是由应力迁移而不是由电迁移决定的。

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Evaluation of electromigration and stressmigration reliabilities of copper interconnects by a simple pulsed-current stressing technique

By using a simple pulsed-current stressing technique, we have demonstrated that both electromigration and stressmigration resistance of giant-grain Cu interconnects can be evaluated separately in a very efficient manner. From the results of such lifetests, it was found that the reliability of the the Cu interconnect is primarily determined by the stressmigration rather than by the electromigration.<>

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Proceedings of IEEE International Electron Devices Meeting

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