2.5瓦CPW功率放大器MMIC倒装互连

Proceedings of IEEE Electrical Performance of Electronic Packaging Pub Date : 1993-10-20 DOI:10.1109/EPEP.1993.394598

C. Pao, W. Wong, W.D. Gray, C. Liu, D.C. Wang, C.P. Wen

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引用次数: 2

摘要

设计并制作了一种采用高产量倒装芯片互连技术的单片x波段共面波导功率放大器。峰值功率为2.5瓦，功率增加效率优于8 GHz时的24%。

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Flip chip interconnect of 2.5-watt CPW power amplifier MMIC

A monolithic X-band coplanar waveguide power amplifier utilizing high yield flip chip interconnect technology has been designed and fabricated. A peak power of 2.5 watts with a power added efficiency better than 24% at 8 GHz has been achieved.<>

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Proceedings of IEEE Electrical Performance of Electronic Packaging

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