氧退火温度对AlGaN/GaN HEMTs的影响

O. Seok, Young-shil Kim, Jiyong Lim, M. Han
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引用次数: 3

摘要

研究了氧退火温度对AlGaN/GaN hemt漏电流和击穿电压的影响。在550℃下进行氧退火,得到了在VDS= 50 V和VGS= - 5 V时击穿电压为8 30 V,漏极漏电流为1.2 nA/mm的低漏极电流。当退火温度达到550℃时,由于氧退火产生的深阱密度高,阻滞特性得到改善。然而,当退火温度超过550℃时,由于AlGaN/GaN hemt表面的热损伤,器件的阻滞特性下降。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of oxygen annealing temperature on AlGaN/GaN HEMTs
We have investigated an effect of oxygen annealing temperature on the leakage current and breakdown voltage of AlGaN/GaN HEMTs. The breakdown voltage of 8 30 V and a low drain leakage current of 1.2 nA/mm at VDS= 50 V and VGS= −5 V are exhibited by employing oxygen annealing at 550°C. The blocking characteristics are improved with increasing annealing temperature up to 550°C due to high density of deep traps generated by oxygen annealing. However, the blocking characteristics of the annealed device were degraded when the annealing temperature exceeds 550°C due to thermal damage on the surface of AlGaN/GaN HEMTs.
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