用于温度测量的二次标准和工作标准的远程询问硅光子芯片

2019 Photonics North (PN) Pub Date : 2019-05-01 DOI:10.1109/PN.2019.8819562

S. Dedyulin, S. Janz, D. Xu, A. Todd, M. Vachon, S. Wang, J. Weber

{"title":"用于温度测量的二次标准和工作标准的远程询问硅光子芯片","authors":"S. Dedyulin, S. Janz, D. Xu, A. Todd, M. Vachon, S. Wang, J. Weber","doi":"10.1109/PN.2019.8819562","DOIUrl":null,"url":null,"abstract":"We present the design and experimental results for a silicon photonic thermometer module for secondary and working thermometry standards. The chip is mechanically robust and insensitive to contamination. Using surface coupling gratings the chip temperature can be monitored remotely using free space beams, thereby eliminating temperature hysteresis effects arising from conventional optical assembly methods and materials.","PeriodicalId":448071,"journal":{"name":"2019 Photonics North (PN)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Silicon Photonic Chips Using Remote Interrogation for Secondary and Working Standards in Thermometry\",\"authors\":\"S. Dedyulin, S. Janz, D. Xu, A. Todd, M. Vachon, S. Wang, J. Weber\",\"doi\":\"10.1109/PN.2019.8819562\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present the design and experimental results for a silicon photonic thermometer module for secondary and working thermometry standards. The chip is mechanically robust and insensitive to contamination. Using surface coupling gratings the chip temperature can be monitored remotely using free space beams, thereby eliminating temperature hysteresis effects arising from conventional optical assembly methods and materials.\",\"PeriodicalId\":448071,\"journal\":{\"name\":\"2019 Photonics North (PN)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 Photonics North (PN)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PN.2019.8819562\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Photonics North (PN)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PN.2019.8819562","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文介绍了一种用于二次和工作温度测量标准的硅光子温度计模块的设计和实验结果。这种芯片在机械上很坚固，对污染不敏感。利用表面耦合光栅，可以利用自由空间光束远程监测芯片温度，从而消除传统光学组装方法和材料引起的温度滞后效应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Silicon Photonic Chips Using Remote Interrogation for Secondary and Working Standards in Thermometry

We present the design and experimental results for a silicon photonic thermometer module for secondary and working thermometry standards. The chip is mechanically robust and insensitive to contamination. Using surface coupling gratings the chip temperature can be monitored remotely using free space beams, thereby eliminating temperature hysteresis effects arising from conventional optical assembly methods and materials.

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2019 Photonics North (PN)

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