{"title":"热感知三维片上网络系统非平稳不规则网格的传输层辅助路由","authors":"Chih-Hao Chao, Tsu-Chu Yin, Shu-Yen Lin, A. Wu","doi":"10.1109/SOCC.2011.6085086","DOIUrl":null,"url":null,"abstract":"Thermal issue is important for 3D Network-on-Chip systems. To ensure thermal safety, run-time thermal management is required. However, the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) scheme and two algorithms for thermal-aware 3D NoC. Based on the experimental results, the proposed routing scheme can reduce the latency over 57.5% and improve the throughput above 1.47x.","PeriodicalId":365422,"journal":{"name":"2011 IEEE International SOC Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Transport Layer Assisted Routing for Non-Stationary Irregular mesh of thermal-aware 3D Network-on-Chip systems\",\"authors\":\"Chih-Hao Chao, Tsu-Chu Yin, Shu-Yen Lin, A. Wu\",\"doi\":\"10.1109/SOCC.2011.6085086\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal issue is important for 3D Network-on-Chip systems. To ensure thermal safety, run-time thermal management is required. However, the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) scheme and two algorithms for thermal-aware 3D NoC. Based on the experimental results, the proposed routing scheme can reduce the latency over 57.5% and improve the throughput above 1.47x.\",\"PeriodicalId\":365422,\"journal\":{\"name\":\"2011 IEEE International SOC Conference\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International SOC Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOCC.2011.6085086\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International SOC Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOCC.2011.6085086","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Transport Layer Assisted Routing for Non-Stationary Irregular mesh of thermal-aware 3D Network-on-Chip systems
Thermal issue is important for 3D Network-on-Chip systems. To ensure thermal safety, run-time thermal management is required. However, the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) scheme and two algorithms for thermal-aware 3D NoC. Based on the experimental results, the proposed routing scheme can reduce the latency over 57.5% and improve the throughput above 1.47x.