一种基于0.008 mm2面积优化热扩散的160纳米CMOS温度传感器,用于SoC热监测

Ugur Sonmez, Rui Quan, F. Sebastiano, K. Makinwa
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引用次数: 15

摘要

在标准的160纳米CMOS工艺中,实现了基于体硅温度相关热扩散系数的温度传感器阵列。该传感器在-40至125°C范围内无微调时的误差为±2.4°C (3σ),在一次温度微调时的误差为±0.65°C (3σ)。每个传感器占地0.008 mm2,在1 kSa/s下实现0.21°C (rms)的分辨率。这种精度、速度和小尺寸的结合使得这种传感器非常适合微处理器和其他片上系统的热监测。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 0.008-mm2 area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring
An array of temperature sensors based on the temperature-dependent thermal diffusivity of bulk silicon has been realized in a standard 160-nm CMOS process. The sensors achieve an inaccuracy of ±2.4 °C (3σ) from -40 to 125 °C with no trimming and ±0.65 °C (3σ) with a one temperature trim. Each sensor occupies 0.008 mm2, and achieves a resolution of 0.21 °C (rms) at 1 kSa/s. This combination of accuracy, speed, and small size makes such sensors well suited for thermal monitoring in microprocessors and other systems-on-chip.
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