光栅增强技术:物理设计的意义和挑战

W. Grobman, M. Thompson, R. Wang, C. Yuan, Ruiqi Tian, E. Demircan
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引用次数: 33

摘要

在本文中,我们回顾了相移光刻、基于规则与基于模型的OPC方法和基于模型的平铺方法,并讨论了它们对布局和验证的影响。我们将讨论新的方法,在线上使用偏光膜,这将改变相移着色的游戏,并可能导致c:PSM物理设计约束的新方向。我们强调需要进行模型驱动的平铺,并使用优化技术来实现平面性,以便在亚波长尺寸时代获得更好的制造公差。给出了估算平铺对电路定时影响的电磁求解结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reticle enhancement technology: implications and challenges for physical design
In this paper, we review phase shift lithography, rule vs. model based methods for OPC and model-based tiling, and discuss their implications for layout and verification. We will discuss novel approaches, using polarizing films on reticles, which change the game for phase-shift coloring, and could lead to a new direction in c:PSM constraints on physical design. We emphasize the need to do tiling that is model-driven and uses optimization techniques to achieve planarity for better manufacturing tolerance in the subwavelength dimensions era. Electromagnetic solver results will be presented which estimate the effect of tiling on circuit timing.
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