模块装配物理模型的验证

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122318

R. Iannuzzelli

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引用次数: 6

摘要

给出了一些典型的电子组件装配模型，并给出了验证这些模型有效性的数据。研究了六个案例:两个案例的PTH/PWB(镀通孔/印刷线路板)模型验证;SMT(表面贴装技术)可靠性预测使用矩阵蠕变法;SMT对接接头蠕变断裂次数预测;PGA (pin grid array)开裂;在BON(床钉)测试中PWB挠度的预测[j]

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Validation of module assembly physical models

Some typical models used in the assembly of electronic modules are presented along with data establishing the validity of these models. Six cases are examined: two cases of PTH/PWB (plated-through-hole/printed wiring board) model validation: SMT (surface mount technology) reliability prediction using the matrix creep method; prediction of creep rupture times of SMT butt joints; PGA (pin grid array) cracking; and prediction of PWB deflection during BON (bed-of-nails) testing.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

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