尼康步进电机对准建模分析

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232634

F. He, Jun Wang, Zhiming Wu, Yadong Jiang, K. Yuan

{"title":"尼康步进电机对准建模分析","authors":"F. He, Jun Wang, Zhiming Wu, Yadong Jiang, K. Yuan","doi":"10.1109/IPFA.2009.5232634","DOIUrl":null,"url":null,"abstract":"The alignment system, as one of key component for stepper, developed rapidly in the last few years because of huge requirement on advanced exposing tools for VLSI and MEMS. Alignment accuracy is mainly affected by errors coming from mark deformations and optical system. In this paper, we combined mathematical model of Nikon stepper alignment optical system and analyzed alignment errors of Nikon stepper caused by mark deformation in different processes. The model was verified by different experiments. Finally some improvement process is put forward to enhance alignment accuracy.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Analysis of alignment modeling for Nikon steppers\",\"authors\":\"F. He, Jun Wang, Zhiming Wu, Yadong Jiang, K. Yuan\",\"doi\":\"10.1109/IPFA.2009.5232634\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The alignment system, as one of key component for stepper, developed rapidly in the last few years because of huge requirement on advanced exposing tools for VLSI and MEMS. Alignment accuracy is mainly affected by errors coming from mark deformations and optical system. In this paper, we combined mathematical model of Nikon stepper alignment optical system and analyzed alignment errors of Nikon stepper caused by mark deformation in different processes. The model was verified by different experiments. Finally some improvement process is put forward to enhance alignment accuracy.\",\"PeriodicalId\":210619,\"journal\":{\"name\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2009.5232634\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232634","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

由于超大规模集成电路和微机电系统对先进的曝光工具的要求越来越高，校准系统作为步进器件的关键部件之一，近年来发展迅速。对准精度主要受标记变形和光学系统误差的影响。本文结合尼康步进准直光学系统的数学模型，分析了尼康步进准直光学系统在不同加工过程中由于标记变形引起的准直误差。通过不同的实验对模型进行了验证。最后提出了提高对准精度的改进措施。

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Analysis of alignment modeling for Nikon steppers

The alignment system, as one of key component for stepper, developed rapidly in the last few years because of huge requirement on advanced exposing tools for VLSI and MEMS. Alignment accuracy is mainly affected by errors coming from mark deformations and optical system. In this paper, we combined mathematical model of Nikon stepper alignment optical system and analyzed alignment errors of Nikon stepper caused by mark deformation in different processes. The model was verified by different experiments. Finally some improvement process is put forward to enhance alignment accuracy.

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来源期刊

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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