{"title":"构建无所不在的无线连接之路，从材料到系统","authors":"Luis Andia, Yvan Morandini","doi":"10.1109/EDTM55494.2023.10103048","DOIUrl":null,"url":null,"abstract":"Wireless systems and applications evolve together with the semiconductor technologies that make them possible. An essential element of such systems is the RF Front End (RFFE). In this paper, selected contributions of engineered substrates to the mobile 5G and Wi-Fi devices RFFE performance are studied. It provides guidance on required substrate evolution needed to address new and emerging challenges associated with next generation of wireless systems.","PeriodicalId":418413,"journal":{"name":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Building the Path to Ubiquitous Wireless Connectivity, from Materials to Systems\",\"authors\":\"Luis Andia, Yvan Morandini\",\"doi\":\"10.1109/EDTM55494.2023.10103048\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wireless systems and applications evolve together with the semiconductor technologies that make them possible. An essential element of such systems is the RF Front End (RFFE). In this paper, selected contributions of engineered substrates to the mobile 5G and Wi-Fi devices RFFE performance are studied. It provides guidance on required substrate evolution needed to address new and emerging challenges associated with next generation of wireless systems.\",\"PeriodicalId\":418413,\"journal\":{\"name\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTM55494.2023.10103048\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM55494.2023.10103048","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Building the Path to Ubiquitous Wireless Connectivity, from Materials to Systems
Wireless systems and applications evolve together with the semiconductor technologies that make them possible. An essential element of such systems is the RF Front End (RFFE). In this paper, selected contributions of engineered substrates to the mobile 5G and Wi-Fi devices RFFE performance are studied. It provides guidance on required substrate evolution needed to address new and emerging challenges associated with next generation of wireless systems.
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