{"title":"基于临界面积计算的冗余产量模型","authors":"K. Mitsutake, Y. Ushiku","doi":"10.1109/ISSM.2000.993645","DOIUrl":null,"url":null,"abstract":"To optimize the redundancy design, the yield model with redundancy is proposed. In this model the accurate number of redundancies to repair one fault is taken into consideration. The calculated yield with redundancy by using this model and the real one are in good agreement. As a result of the application for several redundancy designs, a guide to obtain higher yield is presented.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Yield model with redundancy based on critical area calculations\",\"authors\":\"K. Mitsutake, Y. Ushiku\",\"doi\":\"10.1109/ISSM.2000.993645\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To optimize the redundancy design, the yield model with redundancy is proposed. In this model the accurate number of redundancies to repair one fault is taken into consideration. The calculated yield with redundancy by using this model and the real one are in good agreement. As a result of the application for several redundancy designs, a guide to obtain higher yield is presented.\",\"PeriodicalId\":104122,\"journal\":{\"name\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2000.993645\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2000.993645","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Yield model with redundancy based on critical area calculations
To optimize the redundancy design, the yield model with redundancy is proposed. In this model the accurate number of redundancies to repair one fault is taken into consideration. The calculated yield with redundancy by using this model and the real one are in good agreement. As a result of the application for several redundancy designs, a guide to obtain higher yield is presented.