具有t形栅极和空气间隔的多晶硅tft在物联网应用中的射频优势

Z. Yang, Y. Huang, H. Lin, P. W. Li, K. M. Chen, G. Huang
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引用次数: 2

摘要

我们首次报道了自组织的多晶硅TFT结构的t形硅化栅极,空气间隔,以及硅化源/漏极,在单一的蚀刻过程中,然后是Ni自对准硅化(SALICIDE)过程。t形栅极长度和侧壁空气间隔的过程控制可调性已被证明,使高性能射频(RF)多晶硅tft的核心构建块切实可行。利用透射电子显微镜(TEM)、能量色散x射线能谱(EDS)、栅极电阻、侧壁电容以及直流和射频测量对t栅多晶硅tft的详细结构和电学性能进行了评估。值得注意的是,我们的t栅多晶硅tft的通道长度为96 nm,单位增益频率为12.1 GHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Radio-frequency Superiority of Poly-Si TFTs with T-Shaped Gate and Air Spacers for IoT Applications
We report the first of its kind, self-organized poly-Si TFT structure of T-shaped silicided gate, air-spacers, as well as silicided source/drain in a single etching process followed by Ni self-aligned silicidation (SALICIDE) process. Process-controlled tunability of the T-shaped gate length and sidewall air-spacers have been demonstrated, enabling a practically achievable core building block for high-performance radio-frequency (RF) poly-Si TFTs. Detailed structural and electrical properties of the T-gate poly-Si TFTs were assessed using transmission electron microscopy (TEM), energy dispersive X-ray spectroscopy (EDS), and gate resistance, sidewall capacitance, as well as dc and RF measurements. Notably, unity-gain frequency of 12.1 GHz is recorded for our T-gate poly-Si TFTs with channel length of 96 nm.
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